Ukusebenza Okuhle Kakhulu Kusiza Ukukhiqizwa Okunembile Kwe-3C Electronic
Incazelo Eyinhloko
Izinzwa zeLanbao zisetshenziswa kabanzi ekukhiqizweni kwama-chip, ekucutshungulweni kwe-PCB, ekupakishweni kwezingxenye ze-LED ne-IC, e-SMT, ekuhlanganisweni kwe-LCM nakwezinye izinqubo zomkhakha we-elekthronikhi we-3C, okunikeza izixazululo zokulinganisa zokukhiqiza ngokunemba.
Incazelo Yesicelo
Inzwa ye-Lanbao's through beam photoelectric, inzwa ye-optical fiber, inzwa yokucindezela ingemuva, inzwa yelebula, inzwa yokulinganisa i-laser enembile kakhulu njll. ingasetshenziswa ekuqapheni ukuphakama kwe-PCB, ukuqapha ukulethwa kwe-chip, ukupakishwa kwezingxenye zesekethe ezihlanganisiwe kanye nokunye ukuhlolwa embonini ye-elekthronikhi.
Izigaba ezincane
Okuqukethwe kwencwadi echazayo
Ukuqapha Ukuphakama kwe-PCB
Inzwa ye-photoelectric edlula ngomsebe ingaqaphela ukuqapha ukuphakama kwe-PCB okufushane nokunembile, futhi inzwa yokufuduka nge-laser ingalinganisa ngokunembile ukuphakama kwezingxenye ze-PCB futhi ibone izingxenye eziphakeme kakhulu.
Ukuqapha Ukulethwa Kwezitshiphu
Inzwa yefayibha yokukhanya isetshenziselwa ukuthola ukuthi ama-chip awatholakali yini kanye nokuqinisekisa ukuthi ama-chip ayathathwa endaweni encane kakhulu.
Ukupakishwa kwe-semiconductor
Inzwa yokucindezela i-photoelectric yangemuva ikhomba ngokunembile isimo sokudlula kwe-wafer, futhi inzwa yesikhala esinomumo we-U isetshenziselwa ukuhlolwa kwe-wafer endaweni kanye nokubekwa kwayo.