Ukusebenza okugqwesileyo Inceda i-3C yeMveliso echanekileyo yoMbane
Inkcazo ephambili
I-sensor ze-Lanbao zisetyenziswa ngokubanzi kwimveliso ye-chip, i-PCB processing, i-LED kunye ne-IC yecandelo lokupakisha, i-SMT, indibano ye-LCM kunye nezinye iinkqubo ze-3C ze-electronics industry, ukubonelela ngezisombululo zokulinganisa ukuveliswa ngokuchanekileyo.
Inkcazo yesicelo
I-Lanbao's ngokusebenzisa i-sensor ye-photoelectric ye-beam, i-fiber optical sensor, i-sensor yokucinezela yangasemva, inzwa yeleyibhile, i-laser ephezulu echanekileyo yokulinganisa i-sensor njl.
Izintlu ezingaphantsi
Umxholo weprospectus
PCB Height Monitoring
Ngokusebenzisa i-sensor ye-photoelectric ye-beam inokubona umgama omfutshane kunye nokuchaneka okuphezulu kokuphakama kwe-PCB, kunye ne-laser displacement sensor inokulinganisa ngokuchanekileyo ubude bamacandelo e-PCB kwaye ichonge izinto eziphezulu kakhulu.
UkuJonga ukuHanjiswa kweChip
Isivamvo sefiber ye-Optical isetyenziselwa ukubonwa kwe-chip elahlekileyo kunye nokuqinisekiswa kwe-chip-up kwindawo encinci kakhulu.
Ukupakishwa kweSemiconductor
I-background suppression photoelectric sensor ichaza ngokuchanekileyo imeko yokudlula ye-wafer, kwaye i-slot ye-slot ye-U-shaped sensor isetyenziselwa ukuhlolwa kwe-wafer kwi-site kunye nokubeka.