Ukusebenza Okugqwesileyo Kunceda Ukuveliswa Kwemveliso Ye-3C Echanekileyo Ye-elektroniki
Inkcazelo ephambili
Izinzwa zeLanbao zisetyenziswa kakhulu kwimveliso yeetshiphusi, ukucubungula iiPCB, ukupakisha iinxalenye ze-LED kunye ne-IC, i-SMT, i-LCM assembly kunye nezinye iinkqubo zoshishino lwe-elektroniki lwe-3C, zibonelela ngezisombululo zokulinganisa imveliso echanekileyo.
Inkcazo yesicelo
I-Lanbao's through beam photoelectric sensor, i-optical fiber sensor, i-background compression sensor, i-label sensor, i-high-precision laser ranging sensor njl.njl. zingasetyenziselwa ukujonga ubude be-PCB, ukujonga ukuhanjiswa kweetshiphusi, ukupakishwa kwee-component circuit component kunye nezinye iimvavanyo kushishino lwe-elektroniki.
Iindidi ezingaphantsi
Umxholo weprospekthasi
Ukubeka iliso kubude bePCB
I-sensor ye-photoelectric edlula kwi-beam inokwenza ukujonga ukuphakama kwe-PCB okufutshane nokuchanekileyo, kwaye i-sensor yokufuduka kwe-laser inokulinganisa ngokuchanekileyo ukuphakama kwe-PCB kwaye ichonge i-ultra-high components.
Ukubeka iliso ekuhanjisweni kweetships
I-optical fiber sensor isetyenziselwa ukufumanisa ukuba akukho chips zikhoyo kunye nokuqinisekisa ukuba zithathwa kwindawo encinci kakhulu.
Ukupakishwa kweSemiconductor
I-background depression photoelectric sensor ichaza ngokuchanekileyo imeko yokudlula kwe-wafer, kwaye i-slot sensor enomfanekiso we-U isetyenziselwa ukuhlolwa kwe-wafer kwindawo kunye nokubekwa kwayo.