Ukukhiqiza ama-semiconductor kume njengomunye wemikhakha edinga ukunemba neyinkimbinkimbi kakhulu yezobuchwepheshe embonini yanamuhla yobuchwepheshe obuphezulu. Njengoba inqubo ye-chip iqhubekela ku-3nm ngisho namanodi amancane, ukunemba kwezilinganiso zogqinsi lwe-wafer, ukucaba kwendawo, nobukhulu besakhiwo se-microstructure kunquma ngokuqondile ukuvunwa kwe-chip nokusebenza. Kulo mongo, izinzwa zokususwa kwe-laser, ngokusebenza kwazo okungaxhunywanga, ukunemba okuphezulu, izikhathi zokuphendula ngokushesha, nokuzinza okuthuthukisiwe, seziphenduke "amehlo okulinganisa" abaluleke kakhulu kuyo yonke inqubo yokukhiqiza i-semiconductor.
Njengengxenye eyisisekelo yokwenziwa kwedivayisi ye-semiconductor, ama-wafer adinga ukunemba okudlulele nokwethembeka ngesikhathi sokukhiqiza. Phakathi kwezigaba eziningi ezibucayi zokwenziwa kwe-wafer, ukukalwa okunembile kokugudluzwa kubalulekile—kuthinta ngokuqondile ukusebenza kwe-chip yokugcina kanye nesivuno. Njengomholi wokuqamba izinto ezintsha emkhakheni wezimboni zaseChina, izinzwa ze-Lansensor PDE zochungechunge lokufuduka kwe-laser, ezinokulungiswa kwezinga le-micron, ama-algorithms ahlakaniphile, nokuthembeka kwebanga lezimboni, kuvele njengesixazululo esithandwayo sezinqubo zokukhiqiza ama-wafer.
Izinselelo Ezinembile Ekwenziweni Kwe-Wafer kanye Nezinzuzo Zezinzwa Zokususwa Kwe-Laser
Ukukhiqizwa kwe-wafer kuhilela uchungechunge lwezinqubo eziyinkimbinkimbi ezifana ne-photolithography, i-etching, ukufakwa kwefilimu emincane, kanye ne-bonding—ngayinye idinga ukunemba okuqinile ku-micrometer noma ileveli ye-nanometer. Ngokwesibonelo:
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Ku-photolithography, ukuqondanisa okunembayo phakathi kwe-photomask ne-wafer kubalulekile ukuze kuqinisekiswe ukudluliswa kwephethini okunembile endaweni eyiwafa.
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Ngesikhathi sokufakwa kwefilimu emincane, ukulawula okuqondile kogqinsi lwefilimu kubalulekile ukuze kuqinisekiswe ukusebenza kukagesi kwamadivayisi.
Ngisho nokuchezuka okuncane kungaholela ekulimaleni komkhiqizo noma kwenze inqwaba yamawafa angasebenzi.
Izindlela zokulinganisa zemishini ezivamile ngokuvamile aziphumeleli ekuhlangabezaneni nezidingo zokunemba okuphezulu okunjalo. Ngaphezu kwalokho, bazifaka engcupheni yokulimaza noma ukungcolisa indawo eyisinkwa entekenteke, kuyilapho isivinini sabo sokuphendula esinensayo sibenza banganeleli izidingo ze-metrology ezisezingeni eliphezulu.
I-LanbaoinzwaI-PDE Series Laser Displacement Sensors: Isixazululo Esilungile Sezicelo Zesicwecwe
◆Ukulinganisa kwe-Laser okungeyena othintana naye
Isebenzisa i-laser beam projection endaweni eqondiwe, ihlaziya amasiginali abonisiwe/ahlakazekile ukuze ithole idatha yokufuduka - iqeda ukuthintana ngokomzimba nama-wafers ukuvikela ukulimala komshini kanye nezingozi zokungcola.
◆Ukunemba kwezinga le-Micron
Ubuchwepheshe be-laser obuthuthukisiwe kanye nama-algorithms okucubungula isignali aletha ukunemba nokulungiswa kwesikali se-micrometer, ehlangabezana nezidingo ezinembayo ezidlulele zezinqubo zokwenziwa kwe-wafer.
◆Impendulo eshesha kakhulu (<10ms)
Inika amandla ukuqapha kwesikhathi sangempela kokuhluka kokukhiqiza okuguquguqukayo, okuvumela ukutholwa kokuchezuka ngokushesha nokulungiswa ukuze kuthuthukiswe ukusebenza kahle kokukhiqiza.
◆Ukuhambelana Okukhethekile
Iyakwazi ukulinganisa izinto ezahlukahlukene kanye nezinhlobo zangaphezulu ezinokuguquguquka okuqinile kwemvelo, ezifanele izigaba zenqubo ye-semiconductor eminingi.
◆I-Compact Industrial Design
I-compact form factor isiza ukuhlanganiswa okungenamthungo kumishini ezenzakalelayo nezinhlelo zokulawula, okuvumela ukuqapha kwenqubo ehlakaniphile nokulungiswa kweluphu evaliwe.
Izimo Zokusebenza zeI-PDE Series Laser Displacement Sensorsku-Wafer Processing
Inzwa ye-LanbaoI-PDE Series Laser Displacement Sensors: Izicelo Ezibalulekile Ekwenziweni Kwe-Wafer
Ngokusebenza okukhethekile, izinzwa ze-Lansensor PDE laser displacement zidlala indima ebalulekile kuzo zonke izinqubo eziningi zokwenziwa kwe-wafer:
◆Ukuqondanisa kwe-Wafer & Positioning
Ngezinqubo ze-photolithography ne-bonding ezidinga ukunemba kweleveli ye-micron, izinzwa zethu zikala ngokunembile indawo ye-wafer nama-engeli atshekile ukuze kuqinisekiswe ukuqondana okuphelele kwe-mask-to-wafer kanye nokuma kwengalo ebophayo - ithuthukisa ukunemba kokudlulisa iphethini.
◆I-Wafer Thickness Metrology
Ukunika amandla ukulinganiswa kokuqina okungathinteki ngokuqapha kwesikhathi sangempela phakathi nezinqubo zokubeka, okuqinisekisa ukulawulwa kwekhwalithi yefilimu elincanyana elilungile.
◆Ukuhlolwa kwe-Wafer Flatness
Ithola i-wafer warpage kanye nokuwohloka kwendawo ngokulungiswa kwe-sub-micron ukuze kuvinjelwe amawafa anesici ukuthi aqhubekele phansi.
◆Ukuqapha Ukuqina Kwefilimu Encane
Ukuhlinzeka ngokulandelela kobukhulu bokubekwa kwesikhathi sangempela phakathi nezinqubo ze-CVD/PVD ukuze kugcinwe imininingwane eqinile yokusebenza kukagesi.
◆Ukuthola Ukonakala Kobuso
Ukuhlonza okudidayo kwendawo yesilinganiso esincane (imihuzuko, izinhlayiya) ngokusebenzisa imephu yokususa enokulungiswa okuphezulu, kuthuthukisa kakhulu amazinga okuthola amaphutha.
◆Equipment Condition Monitoring
Ukulandelela ukususwa kwezingxenye ezibalulekile (izingalo zerobhothi, ukunyakaza kwesiteji) nokudlidliza komshini ukuze kulungiswe okubikezelwayo kanye nokwenza kahle ukuzinza.
Uchungechunge lwe-PDE yezinzwa ze-Lanbao alugcini nje ngokuvala izikhala zobuchwepheshe ezibucayi emakethe yezinzwa zezimboni zaseChina ezisezingeni eliphezulu kodwa lusungula amabhentshimakhi amasha omhlaba ngokusebenza kwawo okukhethekile. Kungakhathaliseki ukuthi ukukhulisa amanani esivuno, ukunciphisa izindleko zokukhiqiza, noma ukusheshisa ukuthuthukiswa kwenqubo yesizukulwane esilandelayo, uchungechunge lwe-PDE limi njengesikhali sakho esiphezulu sokunqoba izinselele zokukhiqiza eziqondile ze-semiconductor!
Isikhathi sokuthumela: May-08-2025