Emkhakheni wokukhiqiza we-semiconductor, ukuhlanganiswa kwama-chip okungajwayelekile kuyinkinga enkulu yokukhiqiza. Ukuhlanganiswa kwama-chip okungalindelekile ngesikhathi senqubo yokukhiqiza kungaholela ekulimaleni kwemishini kanye nokwehluleka kwenqubo, futhi kungabangela nokulahlwa kwemikhiqizo ngobuningi, okubangela ukulahlekelwa okukhulu kwezomnotho kwamabhizinisi.
Ngokuthuthukiswa okuqhubekayo kwezinqubo zokukhiqiza ze-semiconductor, izidingo eziphakeme zibekwa ekulawulweni kwekhwalithi ngesikhathi sokukhiqiza. Izinzwa zokuhambisa i-laser, njengobuchwepheshe bokulinganisa obungenakuthintana, obunembile kakhulu, zinikeza ikhambi eliphumelelayo lokuthola ukukhubazeka kokufaka ama-chip ngamakhono azo okuthola okusheshayo nokunembile.
Isimiso Sokuthola kanye Nengqondo Yokwahlulela Okungavamile
Enqubweni yokukhiqiza ye-semiconductor, ama-chip avame ukufakwa ezithwalini noma ezindleleni zokuthutha ngendlela eyodwa, ehlelekile. Ngalesi sikhathi, ukuphakama kobuso be-chip kuyinani eliyisisekelo elisethwe ngaphambilini, ngokuvamile isamba sobukhulu be-chip kanye nokuphakama kobuso be-carrier. Uma ama-chip ehlanganiswa ngengozi, ukuphakama kobuso bawo kuzokhula kakhulu. Lolu shintsho lunikeza isisekelo esibalulekile sokuthola ukukhubazeka kokunqwabelana.
Ukutholwa Kokunqwabelana Kwethrekhi Yezokuthutha
Imizila yokuthutha iyiziteshi ezibalulekile zokuhamba kwe-chip ngesikhathi senqubo yokukhiqiza. Kodwa-ke, ama-chip angase aqongeleleke emigwaqweni ngenxa yokumuncwa kwe-electrostatic noma ukwehluleka kwemishini ngesikhathi sokuthutha, okuholela ekuvinjweni kwemizila. Ukuvinjelwa okunjalo akugcini nje ngokuphazamisa ukugeleza kokukhiqiza kodwa futhi kulimaza ama-chip.
Ukuze kuqashwe ukugeleza okungavinjelwe kwemizila yokuthutha, izinzwa zokuhambisa nge-laser zingafakwa ngaphezu kwemizila ukuze ziskene ukuphakama kwengxenye yethrekhi. Uma ukuphakama kwendawo esendaweni kungavamile (isb., kuphakeme noma kuphansi kunobukhulu besendlalelo esisodwa sama-chips), izinzwa zizokubona njengokuvinjelwa kwe-stacking futhi ziqalise indlela ye-alamu yokwazisa opharetha ngokuphathwa ngesikhathi, ukuqinisekisa ukugeleza kokukhiqiza okubushelelezi.
Inqubo Yokuthola
Izinzwa zokuhambisa i-laser ye-Lanbao zilinganisa ngokunembile ukuphakama kwezindawo eziqondiwe ngokukhipha umsebe we-laser, ukuthola isignali eboniswayo, nokusebenzisa indlela ye-triangulation.
Inzwa iqondaniswe ngokuqondile nendawo yokuthola ama-chip, ikhipha i-laser njalo futhi ithola isignali eboniswayo. Ngesikhathi sokuthutha ama-chip, inzwa ingathola ulwazi lokuphakama kwendawo ngesikhathi sangempela.
Inzwa isebenzisa i-algorithm yangaphakathi ukubala inani lokuphakama kobuso be-chip kusukela kusignali ebonisiwe etholiwe. Ukuze kuhlangatshezwane nezidingo zokudlulisa ngesivinini esikhulu zemigqa yokukhiqiza ye-semiconductor, lokhu kudinga ukuthi inzwa ibe nokunemba okuphezulu kanye nemvamisa ephezulu yokusampula.
Kusethwa ububanzi bokwehluka kokuphakama obuvumelekile, ngokuvamile obungu-±30 µm ukusuka ekuphakameni okuyisisekelo. Uma inani elilinganisiwe lidlula leli banga lomkhawulo, kutholakala ukuthi liyiphutha lokufaka inqwaba. Lo mqondo wokunquma umkhawulo ungahlukanisa ngempumelelo phakathi kwama-chip ajwayelekile anesendlalelo esisodwa nama-chip ahlanganisiwe.
Uma kutholakala ukuthi kukhona okungajwayelekile kokunqwabelana, inzwa ivula i-alamu ezwakalayo nebonakalayo, bese ivula ingalo yerobhothi ngesikhathi esifanayo ukususa indawo engajwayelekile, noma imise umugqa wokukhiqiza ukuze ivimbele ukuwohloka okuqhubekayo kwesimo. Le ndlela yokusabela ngokushesha inciphisa ukulahlekelwa okubangelwa ukungajwayelekile kokunqwabelana ngezinga elikhulu.
Ukutholwa kwesikhathi sangempela nokunembile kakhulu kokuphazamiseka kokufakwa kwama-chip kusetshenziswa izinzwa zokuhambisa i-laser kungathuthukisa kakhulu ukuthembeka kanye nokukhiqiza kwemigqa yokukhiqiza ye-semiconductor. Ngokuthuthuka okuqhubekayo kwezobuchwepheshe, izinzwa zokuhambisa i-laser zizodlala indima enkulu nakakhulu ekukhiqizweni kwe-semiconductor, zinikeze ukwesekwa okuqinile kwentuthuko eqhubekayo yemboni.
Isikhathi sokuthunyelwe: Mashi-25-2025