Emkhakheni wokukhiqiza we-semiconductor, ukupakishwa kwama-chip okungavamile kuyinkinga yokukhiqiza enzima. Ukupakishwa okungalindelekile kwama-chips ngesikhathi senqubo yokukhiqiza kungaholela ekulimaleni kwemishini kanye nokwehluleka kwenqubo, futhi kungase kubangele ukulahlwa okukhulu kwemikhiqizo, okubangele ukulahlekelwa okukhulu kwezomnotho emabhizinisini.
Ngokulungiswa okuqhubekayo kwezinqubo zokukhiqiza i-semiconductor, izimfuno eziphakeme zibekwe ekulawuleni ikhwalithi ngesikhathi sokukhiqiza. Izinzwa zokususwa kwe-laser, njengobuchwepheshe bokulinganisa obungathintani nabo, obunembe kakhulu, buhlinzeka ngesixazululo esisebenzayo sokuthola okungavamile kokupakishwa kwe-chip ngamakhono azo okuthola ngokushesha nanembile.
Umgomo Wokutholwa kanye Nomqondo Wokwahlulela Okungaqondakali
Enqubweni yokukhiqiza i-semiconductor, ama-chips ngokuvamile abekwa kuzinkampani zenethiwekhi noma kumathrekhi okuthutha ngohlelo olulodwa, oluyisicaba. Ngalesi sikhathi, ukuphakama kwendawo ye-chip kuyinani eliyisisekelo elimisiwe, ngokuvamile isamba sogqinsi lwe-chip kanye nobude benkampani yenethiwekhi. Uma ama-chips enqwabelene ngephutha, ukuphakama kwawo okungaphezulu kuzokwenyuka kakhulu. Lolu shintsho luhlinzeka ngesisekelo esibalulekile sokuthola ukunqwabelana okungavamile.
Ukuthola Ukunqwabelanisa Kwethrekhi Yezokuthutha
Amathrekhi okuthutha ayiziteshi ezibalulekile zokunyakaza kwama-chip phakathi nenqubo yokukhiqiza. Kodwa-ke, ama-chips angase anqwabelene kumathrekhi ngenxa ye-electrostatic adsorption noma ukwehluleka komshini ngesikhathi sokuthutha, okuholela ekulandeleleni ukuvinjwa. Ukuvinjwa okunjalo akukwazi nje ukuphazamisa ukugeleza kokukhiqiza kodwa futhi kulimaze ama-chips.
Ukuze kuqashwe ukugeleza okungavimbeki kwamathrekhi okuthutha, izinzwa zokususwa kwe-laser zingase zisetshenziswe ngaphezu kwamathrekhi ukuze kuskenwe ubude besigaba esiphambanayo sethrekhi. Uma ubude bendawo yendawo bungavamile (isb., buphakeme noma buphansi kunogqinsi lwesendlalelo esisodwa samashidi), izinzwa zizokunquma njengokuvaleka kokunqwabelana bese zicupha indlela ye-alamu yokwazisa opharetha ngokuphathwa okufika ngesikhathi, ukuqinisekisa ukugeleza kokukhiqiza okushelelayo.
Inqubo yokuthola
Izinzwa zokususwa kwe-laser ye-Lanbao zikala ngokunembile ubude bezindawo eziqondiwe ngokukhipha i-laser beam, ukuthola isignali ebonisiwe, nokusebenzisa indlela yokuhlanganisa unxantathu.
Inzwa iqondaniswe ngokuqondile nendawo yokuthola i-chip, ilokhu ikhipha i-laser futhi ithola isignali ebonisiwe. Ngesikhathi sokuthutha nge-chip, inzwa ingathola ulwazi lobude besikhathi sangempela.
Inzwa isebenzisa i-algorithm yangaphakathi ukubala inani lobude bendawo ye-chip kusukela kusignali ebonisiwe etholiwe. Ukuze kuhlangatshezwane nezidingo zokudlulisa ngesivinini esiphezulu zemigqa yokukhiqiza i-semiconductor, lokhu kudinga ukuthi inzwa ibe nakho kokubili ukunemba okuphezulu kanye nemvamisa ephezulu yamasampula.
Ibanga elivumelekile lokuhluka kobude lisethiwe, ngokuvamile lingu-±30 µm ukusuka kubude obuyisisekelo. Uma inani elilinganisiwe lidlula lobu bubanzi bomkhawulo, kunqunywa njengokungajwayelekile kwesitaki. Le logic yokunquma i-threshold ingahlukanisa ngempumelelo phakathi kwama-chips anesendlalelo esisodwa nama-chips astakiwe.
Lapho kutholwa okungavamile kokustakika, inzwa icupha i-alamu ezwakalayo nebonakalayo, futhi ngesikhathi esisodwa yenza ingalo yerobhothi isebenze ukuze isuse indawo engajwayelekile, noma imise ulayini wokukhiqiza ukuze kuvinjelwe ukuwohloka okwengeziwe kwesimo. Le ndlela yokuphendula ngokushesha inciphisa ukulahlekelwa okubangelwa ukunqwabelana okungavamile ngokwezinga elikhulu kakhulu.
Ukutholwa kwesikhathi sangempela, ukunemba okuphezulu kokungajwayelekile kokupakishwa kwe-chip kusetshenziswa izinzwa zokususwa kwe-laser kungathuthukisa kakhulu ukuthembeka kanye nesivuno semigqa yokukhiqiza ye-semiconductor. Ngokuthuthuka okuqhubekayo kwezobuchwepheshe, izinzwa zokususwa kwe-laser zizodlala indima enkulu nakakhulu ekukhiqizeni ama-semiconductor, zinikeze ukwesekwa okuqinile kwentuthuko esimeme yemboni.
Isikhathi sokuthumela: Mar-25-2025