Emkhakheni wezokukhiqiza i-semiconductor, ukungajwayelekile kwe-chip scuring kuyinto inkinga enzima yokukhiqiza. Ukufakwa okulindelekile kwama-chips ngesikhathi senqubo yokukhiqiza kungaholela ekulimaleni kwemishini nokusebenza kwehluleka, futhi kungahle kube nomphumela wokuhlunga okukhulu kwemikhiqizo, okubangela ukulahleka kwezomnotho okubalulekile kwamabhizinisi.
Ngokucwengwa okuqhubekayo kwezinqubo zokukhiqiza ze-semiconductor, izimfuno eziphakeme zibekwa kulawulo lwekhwalithi ngesikhathi sokukhiqiza. Izinzwa zokuxoshwa kweLaser, njengobuchwepheshe bokungatholi, okunembile, zinikezela ngesisombululo esisebenzayo sokuthola ama-chip afaka amakhono asheshayo asheshayo namakhono awo okuthola anembayo.
Isimiso sokutholwa kanye ne-anomaly yokwahlulela logic
Enqubweni yokukhiqiza i-semiconductor, ama-chip ngokuvamile abekwe kubathwali noma amathrekhi ezokuthutha engxenyeni eyodwa, ehlelekile. Ngalesi sikhathi, ukuphakama kwe-chip surface kuyinani elisendaweni esesethiwe, ngokuvamile isamba sobukhulu be-chip kanye nokuphakama kwenethiwekhi. Lapho ama-chips afakwe ngengozi, ukuphakama kwawo okungaphezulu kuzokhuphuka kakhulu. Lolu shintsho luhlinzeka ngesisekelo esibalulekile sokuthola ukufakwa kwezindawo.
Ukutholwa kwethrekhi yokuhambisa
Amathrekhi ezokuthutha aneziteshi ezibucayi zokunyakaza kwe-chip ngesikhathi senqubo yokukhiqiza. Kodwa-ke, ama-chips angaqongelela amathrekhi ngenxa yokuthola ama-adford adforder noma ukwehluleka kwemishini ngesikhathi sokuhamba, okuholela ekulandeleleni amabhlokhi. Ama-blockge anjalo awakwazi ukuphazamisa ukugeleza kokukhiqiza kepha futhi alimaze ama-chip.
Ukuqapha ukugeleza okungafakwanga kwamathrekhi wokuhambisa, izinzwa zokuxoshwa kwe-laser zingathunyelwa ngenhla kwamathrekhi ukuskena ukuphakama kwesigaba sethrekhi. Uma ukuphakama kwendawo yasendaweni kungajwayelekile (isib.
Inqubo yokutholwa
Izinzwa zeLanbao Laser zokuhlanyanisa zilinganisa ngokunembile ukuphakama kwezindawo eziqondiwe ngokukhipha ugongolo lwe-laser, ethola isinali elibonisiwe, futhi lisebenzisa indlela yoxantathu.
I-sensor iqondaniswe kahle ngendawo yokutholwa kwe-chip, ngokuqhubekayo ikhipha i-laser nokwamukela isiginali ebonisiwe. Ngesikhathi sokuhamba kwe-chip, inzwa ingathola imininingwane yangempela yokuphakama komhlaba.
Inzwa isebenzisa i-algorithm yangaphakathi ukufaka inani lokuphakama komhlaba we-chip kusuka kusiginali etholwe etholakele. Ukuhlangabezana nezidingo zokudluliselwa okusheshayo okuphezulu kwemigqa yokukhiqiza ze-semiconductor, lokhu kudinga ukuthi inzwa idle ukunemba okuphezulu kanye nemvamisa ephezulu yesampula.
Uhla lokuvulwa okuvuselelwayo lusethwe, ngokujwayelekile ± 30 μm kusuka ekuphakameni kwesisekelo. Uma inani elilinganisiwe lidlula leli pulani lomkhawulo, lizimisele ukuba yinto engahambi kahle. Lokhu kuncipha kwe-Threshold mement kungahluka ngempumelelo phakathi kwama-chips ajwayelekile angenaye-linye nama-chip afakiwe.
Lapho sekutholwa ukungahambi kahle okubusayo, inzwa ibangela i-alamu ezwakalayo nebonakalayo, futhi ngasikhathi sinye isebenze ingalo yamarobhothi ukuze isuse indawo engajwayelekile, noma imema umugqa wokukhiqiza ukuvikela okwengeziwe kwesimo. Le ndlela yokuphendula esheshayo inciphisa ukulahleka okubangelwa ukufaka ama-abnormalities ngezinga elikhulu kakhulu.
Isikhathi sangempela, ukutholwa okunengqondo okuphezulu kokufakwa kwe-Chip Staturtings ngokusebenzisa izinzwa zokuthuthwa kweLaser zingathuthukisa kakhulu ukuthembeka nokuvunyelwa kwemigqa yokukhiqiza i-semiconductor. Ngentuthuko eqhubekayo yezobuchwepheshe, izinzwa zokuxoshwa kwe-laser zizodlala indima enkulu kakhulu ekukhiqizweni kwemithi ye-semiconductor, ukuhlinzeka ngokusekelwa okuqinile kwentuthuko esimeme embonini.
Isikhathi sePosi: Mar-25-2025