Imveliso yeSemiconductor ime njengenye yezona ndawo zifuna ukuchaneka kunye nethekhnoloji entsonkothileyo kwishishini lanamhlanje lobugcisa obuphezulu. Njengoko iinkqubo zetshiphu zihambela phambili ukuya kutsho kwi-3nm nakwezona ndawo zincinci, ukuchaneka kwemilinganiselo yobunzima bewafer, ukucaba komphezulu, kunye nemilinganiselo ye-microstructure imisela ngokuthe ngqo isivuno kunye nokusebenza kwechip. Kulo mxholo, izinzwa zokufuduswa kwe-laser, kunye nokusebenza kwazo okungadibanisiyo, ukuchaneka okuphezulu, amaxesha okuphendula ngokukhawuleza, kunye nozinzo olongeziweyo, ziye zaba "amehlo okulinganisa" ayimfuneko kuyo yonke inkqubo yokwenziwa kwe-semiconductor.
Njengoko i-substrate engundoqo yokwenziwa kwesixhobo se-semiconductor, ii-wafers zifuna ukuchaneka okugqithisileyo kunye nokuthembeka ngexesha lemveliso. Phakathi kwamanqanaba amaninzi abalulekileyo okwenziwa kwe-wafer, umlinganiselo ochanekileyo wokufuduswa ubalulekile-uchaphazela ngokuthe ngqo ukusebenza kwe-chip yokugqibela kunye nesivuno. Njengenkokeli entsha yecandelo lezengqondo laseTshayina, iLansensor's PDE uthotho lwe-laser displacement sensors, enesisombululo senqanaba le-micron, ii-algorithms ezikrelekrele, kunye nokuthembeka komgangatho wemizi-mveliso, ziye zavela njengesisombululo esithandwayo seenkqubo zokwenziwa kwe-wafer.
Imiceli mngeni eChanekileyo kuVeliso lweWafer kunye nezinto eziluncedo zeLaser Displacement Sensors
Ukwenziwa kwe-Wafer kubandakanya uthotho lweenkqubo ezintsonkothileyo ezifana ne-photolithography, i-etching, i-fin-film deposition, kunye ne-bonding-nganye ifuna ukuchaneka okungqongqo kwi-micrometer okanye kwinqanaba le-nanometer. Umzekelo:
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Kwi-photolithography, ulungelelwaniso oluchanekileyo phakathi kwe-photomask kunye ne-wafer kubalulekile ukuqinisekisa ukuhanjiswa kwepateni echanekileyo kumphezulu we-wafer.
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Ngexesha lokubekwa kwefilimu encinci, ulawulo oluchanekileyo lobungqingqwa befilimu lubalulekile ukuze kuqinisekiswe ukusebenza kombane kwezixhobo.
Nokuba ukutenxa kuncinci kunokukhokelela kwiziphene zemveliso okanye kunikeze yonke ibhetshi yeewafers ezingasebenzisekiyo.
Iindlela zesiqhelo zokulinganisa oomatshini zihlala zisilela ekuhlangabezaneni neemfuno ezichaneke ngolo hlobo. Ngaphaya koko, babeka emngciphekweni wokonakalisa okanye ukungcolisa umphezulu we-wafer eethe-ethe, ngelixa isantya sabo sokuphendula esicothayo sibenza banganelanga kwiimfuno zemetroloji.
LanbaoisivamvoPDE Series Laser Displacement Sensors: Isisombululo esiNgcono kwizicelo zeWafer
◆Non-contact Laser Umlinganiselo
Isebenzisa ingqikelelo ye-laser beam kwindawo ekujoliswe kuyo, ukuhlalutya imiqondiso ebonakalisiweyo / esasazekileyo ukufumana idatha yokufuduka - ukuphelisa ukunxibelelana ngokomzimba kunye nee-wafers ukuthintela ukonakala koomatshini kunye nemingcipheko yongcoliseko.
◆Ukuchaneka kwenqanaba leMicron
Itekhnoloji yelaser ekwinqanaba eliphambili kunye ne-algorithms yokusetyenzwa komqondiso kuzisa ukuchaneka komlinganiselo we-micrometer-scale kunye nesisombululo, ukuhlangabezana neemfuno ezichanekileyo ezigqithisileyo zeenkqubo zokwenziwa kwe-wafer.
◆Impendulo ekhawulezayo kakhulu (<10ms)
Yenza uhlolo lwexesha lokwenyani lokwahluka kwemveliso eguquguqukayo, ivumela ukubonwa okutenxa kwangoko kunye nokulungiswa konyuso lokwenziwa kwemveliso.
◆Ukuhambelana kwezinto ezingaqhelekanga
Iyakwazi ukulinganisa izinto ezahlukeneyo kunye neentlobo zomphezulu ezinokuguquguquka okuqinileyo kwendalo, ezifanelekileyo kwizigaba ezininzi zenkqubo ye-semiconductor.
◆Uyilo loShishino oluQinisekileyo
I-compact form factor iququzelela ukuhlanganiswa okungenamthungo kwizixhobo ezizenzekelayo kunye neenkqubo zokulawula, okwenza ukuba inkqubo yokuhlola ingqiqo kunye nokulungelelaniswa kwe-loop evaliweyo.
Iimeko zeSicelo sePDE Series Laser Displacement Sensorskwi-Wafer Processing
Isivamvo seLanbaoPDE Series Laser Displacement Sensors: Izicelo ezibalulekileyo kwi-Wafer Manufacturing
Ngokusebenza okugqwesileyo, i-Lansensor PDE i-laser displacement sensors idlala indima ebalulekileyo kwiinkqubo ezininzi zokwenziwa kwe-wafer:
◆Ulungelelwaniso lweWafer kunye nokumiswa
Kwiphotolithography kunye neenkqubo zokudibanisa ezifuna ukuchaneka kwenqanaba le-micron, izinzwa zethu zilinganisa ngokuchanekileyo indawo ye-wafer kunye nee-engile ezithambekileyo ukuze kuqinisekiswe ulungelelwaniso olugqibeleleyo lwemaski ukuya kwi-wafer kunye nokuma kwengalo edibeneyo-ukuphucula ukuchaneka kokudluliselwa kwepateni.
◆I-Wafer Thickness Metrology
Ukuvumela umlinganiselo wobunzima obungaqhagamshelwanga ngokujongwa kwexesha lokwenyani ngexesha leenkqubo zokubeka, ukuqinisekisa ulawulo lomgangatho wefilimu ebhityileyo.
◆Ukuhlolwa kwe-Wafer Flatness
Ukubona iphepha lewafer kunye nokuguqulwa komphezulu kunye nesisombululo se-sub-micron ukunqanda ama-wafers anesiphene ekuqhubeleni phambili ezantsi.
◆Thin-Film ukutyeba esweni
Ukubonelela ngexesha langempela lokubeka umkhondo wobunzima ngexesha leenkqubo zeCVD/PVD ukugcina imilinganiselo engqongqo yokusebenza kombane.
◆Ukufunyanwa kweSiphene soMphezulu
Ukuchonga i-micron-scale surface anomalies (imikrwelo, amasuntswana) ngokusebenzisa i-high-resolution displacement mapping, iphucula kakhulu izinga lokubona isiphene.
◆Equipment Condition Monitoring
Ukulandelela ukufuduswa kwamacandelo abalulekileyo (iingalo zerobhothi, ukunyakaza kweqonga) kunye nokungcangcazela komatshini ukulungiselela ukugcinwa kwangaphambili kunye nokulungiswa kozinzo.
Uthotho lwe-PDE yesivamvo seLanbao alupheleli nje ekuvaleni izikhewu ezibalulekileyo zetekhnoloji kwimakethi yaseTshayina yokuphela komgangatho ophezulu kodwa iseka ibhenchmarks ezintsha zehlabathi ngomsebenzi wayo obalaseleyo. Nokuba ukonyusa izinga lesivuno, ukunciphisa iindleko zemveliso, okanye ukukhawulezisa uphuhliso lwenkqubo yesizukulwana esilandelayo, uthotho lwePDE limi njengesixhobo sakho sokugqibela sokoyisa imiceli mngeni yokwenziwa kwesemiconductor echanekileyo!
Ixesha lokuposa: May-08-2025