Kwicandelo lemveliso ye-semicondcuctorctor, i-chip engaqhelekanga ye-chip ngumcimbi oqatha wemveliso. Ukutyibilika okungalindelekanga kweetshipsi ngexesha lokwenza imveliso kunokukhokelela ekumonakaleni kwezixhobo kunye nokungalungisi, kwaye kunokubangela ukufunxa kweemveliso, kubangela ilahleko yezoqoqosho yamashishini.
Ngokuphumelela okuqhubekayo kweenkqubo zokwenza i-semiconductor, iimfuno eziphezulu zibekwe kulawulo oluphambili ngexesha lemveliso. I-Laser Shription Shriptions, Njengobuchwephesha obungaqhandiyo, itekhnoloji yokungachaneki echanekileyo, ukubonelela ngesisombululo esisebenzayo sokufumanisa i-chip stacks engaqhelekanga kunye nokuchongwa kwesakhono esichanekileyo nesichanekileyo.
Umgaqo-siseko wokuNgqinayo kunye ne-Onomaly Log
Kwinkqubo yokutsalela i-semiconductor, ii-chips zihlala zibekwe kubathwali okanye kwiindlela zothutho kwi-ratimer enye, ilungiselelo leflethi. Ngeli xesha, ukuphakama komgangatho we-chip lixabiso lesiseko, ngokubanzi isixa esikhulu se-chip kunye nokuphakama kwe-Chier. Xa i-chips ifikile ngengozi, ukuphakama kwabo kuyakhula kakhulu. Olu tshintsho lubonelela ngesiseko esibalulekileyo sokufumanisa ukungasebenzi kakuhle.
Ukuhamba ngenqanawa
Iitrekti zothutho ziziteshi ezibalulekileyo ze-chip ngexesha lenkqubo yokwenziwa. Nangona kunjalo, ii-chips zinokuqokelela kwimikhondo ngenxa ye-adsorption ye-electrostatic okanye ukusilela koomatshini ngexesha lothutho, kukhokelela ekulandeleleni iibhloksi. Ibhloko enjalo ayinakuphazamisa kuphela ukuhamba kwemveliso ngaphandle kwemveliso kodwa kungonakalisa i-chips.
Ukubeka iliso kwindlela yokuhamba kwezothutho, i-Laser Shriccectiveen inokuthi ithunyelwe ngaphezulu kweetrekhi ukuze iskene indawo yokuphakama kwecandelo lomkhondo. Ukuba ukuphakama kwendawo yendawo kungaqhelekanga (umzekelo, ngaphezulu okanye ngaphantsi kune-chips enye), iinzwane ziya kuchaza ukuba i-chips i-chips kunye ne-chiggy ye-alamu yokwazisa ngexesha elifanelekileyo, ukuqinisekisa ukuhamba kwemveliso efihlakeleyo.
Inkqubo yokuqaphela
I-LANBAO I-Laser Shorcentement ilinganisa ngokuchanekileyo ukuphakama kwendawo ekujoliswe kuyo ngokubeka umqondiso we-laser, kwaye isebenzise umqondiso oboniswayo, kwaye isebenzise indlela yoTrans.
Inzwane ihambelana ngokuthe tye kwindawo yokuchonga i-chip, ngokuqhubekayo ibeka umqondiso oboniswayo. Ngexesha lokuhamba kweChip, i-sensor inokufumana ulwazi lwexesha lokuphezulu.
Inzwa isebenzisa i-algorithm yangaphakathi yokufaka ixabiso le-chip elingaphezulu kumqondiso oboniswayo. Ukuhlangabezana neemfuno ezihamba ngesantya esiphezulu se-Semiconductor Remines, oku kufuna ukuba i-seminasor inobuntu bobabini kunye nokulunga okuphezulu kwesampulu.
Uluhlu lweentlobo ezahlukeneyo zokwahluka luvunyiweyo lusetiwe, ngokuqhelekileyo ± 30 μm ukusuka kubude obusisiseko. Ukuba ixabiso elilinganisiweyo ligqitha esi sambeko, sizimisele ukuba yinto engaqhelekanga. Esi sithintelo selogic yelogic inokwahlula-hlula ngempumelelo phakathi kweetshipsi eziqhelekileyo kunye neetshipsi ezibekiweyo.
Ukufumanisa ukungaqhelekanga okuqhelekileyo, i-sensor ibangela i-alarm evakalayo nembonakalo, kwaye ngaxeshanye isebenze ngengalo yerobhothi ukuze isuse indawo engaqhelekanga, okanye inqumle umgca wokuvelisa ukuthintela ukonakala kwemeko. Le ndlela yokuphendula ngokukhawuleza inciphisa ilahleko ebangelwa kukungabi nakuphantsi kwelona ngqiqweni.
Ixesha lokwenyani, ukubonwa okuphezulu kwe-chip i-chip yokungasebenzi kakuhle kusetyenziswa iinzwane zokufuduka i-larncurcent kungayiphucula kakhulu ukuthembeka kunye nesivuno semveliso ye-semicondcuctor. Ngenkqubela phambili eqhubekayo yobuchwephesha, i-Laser Shrimontlements iya kudlala indima enkulu ngakumbi kwimveliso ye-semicondcucy, ibonelela ngenkxaso eyomeleleyo kuphuhliso oluzinzileyo lweshishini.
Ixesha lasemva kwexesha: Mar-25-2025