Kwicandelo lemveliso ye-semiconductor, ukupakishwa kwetshiphu okungaqhelekanga ngumba onzima wemveliso. Ukupakishwa kweetshiphusi okungalindelekanga ngexesha lenkqubo yokuvelisa kunokukhokelela kumonakalo wezixhobo kunye nokusilela kwenkqubo, kwaye kunokubangela ukulahlwa kweemveliso ezininzi, okubangela ilahleko enkulu yezoqoqosho kumashishini.
Ngokuphuculwa okuqhubekayo kweenkqubo zokwenziwa kwe-semiconductor, iimfuno eziphezulu zibekwe kulawulo lomgangatho ngexesha lemveliso. I-Laser displacement sensors, njenge-non-contact, iteknoloji yokulinganisa ukuchaneka okuphezulu, ibonelela ngesisombululo esisebenzayo sokubona ukungahambi kakuhle kwe-chip stacking kunye nezakhono zabo zokufumanisa ngokukhawuleza nangokuchanekileyo.
Umgaqo-siseko woFundo kunye neNgcaciso yoMgwebo ongaqhelekanga
Kwinkqubo yokuvelisa i-semiconductor, iitshiphusi zihlala zibekwe kubathwali okanye kwiingoma zothutho kuluhlu olunye, ilungiselelo elisicaba. Ngeli xesha, ukuphakama komphezulu we-chip lixabiso elisisiseko elisetiweyo, ngokubanzi isixa sobunzima be-chip kunye nokuphakama komthwali. Xa iitshiphusi zipakishwe ngengozi, ubude bazo bomphezulu buya kunyuka kakhulu. Olu tshintsho lubonelela ngesiseko esibalulekileyo sokubona izinto ezingahambi kakuhle.
Ukufunyanwa kweTrack yezoThutho zokupakishwa
Imizila yezothutho yimijelo ebalulekileyo yokuhamba kwetshiphu ngexesha lenkqubo yokuvelisa. Nangona kunjalo, iitshiphusi zinokuqokelelana kumzila ngenxa ye-adsorption ye-electrostatic okanye ukusilela koomatshini ngexesha lothutho, okukhokelela ekulandeleni imivalo. Izithintelo ezinjalo azinakuphazamisa kuphela ukuhamba kwemveliso kodwa zinokonakalisa iichips.
Ukubeka iliso ekuhambeni okungahambiyo kweendlela zokuthutha, i-laser displacement sensors ingafakwa ngaphezu kweengoma ukuskena ukuphakama kwecandelo elinqamlezayo. Ukuba umphakamo wendawo yendawo awuqhelekanga (umzekelo, uphezulu okanye ungaphantsi kunobunzima bomaleko omnye weetshiphusi), abenzi boluvo baya kugqiba njengento yokupakisha i-stacking kwaye iqalise indlela ye-alam yokwazisa abaqhubi malunga nokuphathwa kwangexesha, ukuqinisekisa ukuhamba kakuhle kwemveliso.
Inkqubo yokuFumana
I-Lanbao laser displacement sensors ilinganisa ngokuchanekileyo ubude bendawo ekujoliswe kuyo ngokukhupha i-laser beam, ukufumana isignali ebonakalisiweyo, kunye nokusebenzisa indlela ye-triangulation.
I-sensor ihambelana ngokuthe nkqo kunye nendawo yokukhangela i-chip, ngokuqhubekayo ikhupha i-laser kwaye ifumana isignali ebonakalisiweyo. Ngexesha lothutho lwe-chip, inzwa inokufumana ulwazi lwexesha langempela lobude bomphezulu.
Isivamvo sisebenzisa i-algorithm yangaphakathi ukubala umphakamo wexabiso lomphezulu we-chip ukusuka kwisignali ebonakalisiweyo efunyenweyo. Ukuhlangabezana neemfuno zokudluliselwa kwesantya esiphezulu semigca yemveliso ye-semiconductor, oku kufuna ukuba inzwa ibenazo zombini ezichanekileyo ezichanekileyo kunye nesampulu ephezulu.
Uluhlu lobude obuvumelekileyo lusetiwe, ngokuqhelekileyo ±30 µm ukusuka kumphakamo osisiseko. Ukuba ixabiso elilinganisiweyo lingaphezulu kolu luhlu, kumiselwa ukuba sisitaki esingaqhelekanga. Le ngcinga yokumisela umda inokwahlula ngokufanelekileyo phakathi kweetshiphusi eziqhelekileyo ezinomgangatho omnye kunye neetshiphusi ezipakishiweyo.
Emva kokufumanisa ukungahambi kakuhle kwe-stacking, i-sensor ibangela i-alamu evakalayo kunye neyobonwayo, kwaye ngaxeshanye isebenze ingalo yerobhothi ukususa indawo engaqhelekanga, okanye imise umgca wokuvelisa ukuthintela ukuwohloka okuqhubekayo kwimeko. Le ndlela yokuphendula ngokukhawuleza inciphisa ilahleko ebangelwa kukupakisha izinto ezingaqhelekanga ngowona mlinganiselo mkhulu.
Ixesha langempela, ukuchaneka okuphezulu kokuchaneka kwe-chip stacking ezingaqhelekanga usebenzisa i-laser displacement sensors kunokuphucula kakhulu ukuthembeka kunye nesivuno semigca yokuvelisa i-semiconductor. Ngenkqubela phambili yetekhnoloji eqhubekayo, izinzwa zokufuduswa kwelaser ziya kudlala indima enkulu ngakumbi kwimveliso ye-semiconductor, ukubonelela ngenkxaso eyomeleleyo kuphuhliso oluzinzileyo lweshishini.
Ixesha lokuposa: Mar-25-2025