Ho etsa semiconductor ho eme e le e 'ngoe ea likarolo tse hlokang ho nepahala le tse rarahaneng ka ho fetesisa tsa theknoloji indastering ea kajeno ea theknoloji e phahameng. Ha ts'ebetso ea chip e ntse e tsoela pele ho ea ho 3nm esita le li-node tse nyane, ho nepahala ha litekanyo bakeng sa botenya ba liphaephe, ho batalla ha bokaholimo, le boholo ba sebopeho sa microstructure ho supa ka kotloloho chai le tšebetso. Moelelong ona, li-sensor tsa laser displacement, ka ts'ebetso ea tsona e sa amaneng le batho, ho nepahala ho holimo, nako ea karabelo e potlakileng, le botsitso bo ntlafalitsoeng, li fetohile "mahlo a ho lekanya" a bohlokoa nakong eohle ea ts'ebetso ea tlhahiso ea semiconductor.
Joalo ka karolo ea mantlha ea tlhahiso ea sesebelisoa sa semiconductor, li-wafers li hloka ho nepahala le ho ts'epahala haholo nakong ea tlhahiso. Har'a mekhahlelo e mengata ea bohlokoa ea ho etsa li-wafer, tekanyo e nepahetseng ea phalliso ke ea bohlokoa - e ama ka kotloloho ts'ebetso ea chip ea ho qetela le chai. Joaloka moetapele oa boqapi lekaleng la liindasteri la China, li-sensor tsa Lansensor tsa PDE tsa laser displacement, tse nang le qeto ea boemo ba micron, li-algorithms tse bohlale, le ts'epo ea boemo ba indasteri, li hlahile e le tharollo e ratoang bakeng sa lits'ebetso tsa tlhahiso ea li-wafer.
Mathata a Nepahetseng ho Tlhahiso ea Wafer le Melemo ea Li-Sensors tsa Phallo ea Laser
Ho etsoa ha li-wafer ho kenyelletsa letoto la lits'ebetso tse rarahaneng tse kang photolithography, etching, deposition-filimi e tšesaane, le bonding-e 'ngoe le e' ngoe e hloka ho nepahala ho matla ho micrometer kapa esita le nanometer. Ka mohlala:
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Ho photolithography, ho lumellana ho nepahetseng pakeng tsa photomask le wafer ho bohlokoa ho netefatsa phetisetso e nepahetseng holim'a bokaholimo.
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Nakong ea tlhahiso ea filimi e tšesaane, taolo e nepahetseng ea botenya ba filimi e bohlokoa ho netefatsa ts'ebetso ea motlakase ea lisebelisoa.
Esita le ho kheloha ho honyenyane ho ka lebisa ho senyeha ha lihlahisoa kapa ho etsa hore sehlopha sohle sa li-wafers se se ke sa sebelisoa.
Mekhoa e tloaelehileng ea ho metha ea mochini hangata e haelloa ke ho fihlela litlhoko tse joalo tse nepahetseng haholo. Ho feta moo, ba ipeha kotsing ea ho senya kapa ho silafatsa bokaholimo bo bobebe, athe lebelo la bona le liehang la ho arabela le ba etsa hore ba se lekane ho latela litlhoko tsa mantlha tsa metrology.
LanbaokutloPDE Series Laser Displacement Sensors: The Optimal Tharollo bakeng sa Wafer Applications
◆Tekanyo ea Laser e sa amaneng le batho
E sebelisa projeke ea beam ea laser holim'a libaka tse shebiloeng, e sekaseka mats'oao a bonts'itsoeng / a hasaneng ho fumana lintlha tsa phallo - ho felisa ho ama 'mele le li-wafers ho thibela tšenyo ea mochini le likotsi tsa tšilafalo.
◆Precision ea boemo ba Micron
Theknoloji e tsoetseng pele ea laser le li-algorithms tsa ts'ebetso ea mats'oao li fana ka tekanyo e nepahetseng ea tekanyo ea micrometer le tharollo, e fihlelang litlhoko tse nepahetseng haholo tsa ts'ebetso ea ho etsa li-wafer.
◆Karabelo e potlakileng haholo (<10ms)
E nolofalletsa tlhahlobo ea nako ea 'nete ea mefuta e fapaneng ea tlhahiso, e lumella ho lemoha ho kheloha hanghang le ho lokisoa ho ntlafatsa katleho ea tlhahiso.
◆Tšebelisano e Ikhethang ea Lintho
E khona ho lekanya lisebelisoa tse fapaneng le mefuta ea bokaholimo e nang le maemo a matla a tikoloho, a loketseng methati e mengata ea tšebetso ea semiconductor.
◆Moqapi oa Liindasteri o Kopanetsoeng
The compact form factor e thusa ho kopanya ka mokhoa o se nang seam ho lisebelisoa tse ikemetseng le lits'ebetso tsa taolo, e nolofalletsang ho lekola ts'ebetso e bohlale le tokiso e koetsoeng.
Maemo a Kopo eaPDE Series Laser Displacement Sensorska Wafer Processing
Sensor ea LanbaoPDE Series Laser Displacement Sensors: Likopo tse Bohlokoa ho Tlhahiso ea Wafer
Ka ts'ebetso e ikhethang, li-sensor tsa Lansensor PDE laser displacement li phetha karolo ea bohlokoa ho pholletsa le mekhoa e mengata ea ho etsa li-wafer:
◆Wafer Alignment & Positioning
Bakeng sa photolithography le mekhoa ea ho tlamahanngoa e hlokang ho nepahala ha micron-level, li-sensor tsa rona li lekanya hantle boemo ba li-wafer le li-angles tse sekamang ho etsa bonnete ba hore mask-to-wafer a lumellana hantle le ho ema ha matsoho a tlamang - ho ntlafatsa mokhoa oa ho fetisa mokhoa o nepahetseng.
◆Wafer Thickness Metrology
Ho nolofaletsa tekanyo ea botenya ba ho se kopane ka ho beha leihlo ka nako ea sebele nakong ea ts'ebetso ea deposition, ho netefatsa taolo e nepahetseng ea boleng ba filimi e tšesaane.
◆Tlhahlobo ea Wafer Flatness
Ho bona leqephe la li-wafer le deformation ea bokaholimo ka tharollo ea sub-micron ho thibela li-wafers tse nang le bokooa hore li se ke tsa tsoela pele ho theosa le noka.
◆Thin-Film Thickness Monitoring
Ho fana ka tlhaiso-leseling ea nako ea 'nete nakong ea lits'ebetso tsa CVD/PVD ho boloka lintlha tse tiileng tsa ts'ebetso ea motlakase.
◆Ho Hlahlobisisa Sekoli se Phahameng
Ho tsebahatsa liphapang tsa micron-scale surface (mehopo, likaroloana) ka 'mapa oa ho falla o nang le qeto e phahameng, ho ntlafatsa haholo litekanyetso tsa ho lemoha liphoso.
◆Thepa Maemo Tlhokomelo
Ho latela ho falla ha likarolo tsa bohlokoa (matsoho a roboto, metsamao ea sethala) le ho sisinyeha ha mochini bakeng sa tokiso e boletsoeng esale pele le ts'ebetso ea botsitso.
Letoto la PDE la sensor ea Lanbao ha le koahele likheo tsa mahlale a bohlokoa 'marakeng oa li-sensor tsa indasteri ea China feela empa le theha litekanyetso tse ncha tsa lefats'e ka ts'ebetso ea eona e ikhethang. Hore na ho phahamisa litheko tsa lihlahisoa, ho fokotsa litšenyehelo tsa tlhahiso, kapa ho potlakisa nts'etsopele ea mofuta o latelang, letoto la PDE le eme e le sebetsa sa hau sa ho hlola liphephetso tse nepahetseng tsa tlhahiso ea semiconductor!
Nako ea poso: May-08-2025