Semiconductor manufacturing stands yog ib qho ntawm feem ntau precision-thov thiab technologically complex teb nyob rau hauv niaj hnub high-tech kev lag luam. Raws li cov txheej txheem nti nce mus rau 3nm thiab txawm tias me me, qhov tseeb ntawm kev ntsuas rau wafer thickness, nto flatness, thiab microstructure qhov ntev ncaj qha txiav txim siab nti tawm thiab kev ua haujlwm. Nyob rau hauv cov ntsiab lus no, laser displacement sensors, nrog rau lawv tsis-hu ua hauj lwm, superior precision, ceev teb lub sij hawm, thiab txhim khu kev ruaj ntseg, tau dhau los ua indispensable " ntsuas qhov muag" thoob plaws hauv lub semiconductor manufacturing txheej txheem.
Raws li cov tub ntxhais substrate ntawm semiconductor ntaus ntawv fabrication, wafers xav tau huab precision thiab kev ntseeg siab thaum lub sij hawm tsim khoom. Ntawm ntau theem tseem ceeb ntawm kev tsim khoom wafer, kev ntsuas kev hloov pauv yog qhov tseem ceeb - nws cuam tshuam ncaj qha rau qhov kawg nti qhov kev ua tau zoo thiab cov txiaj ntsig. Raws li tus thawj coj ntawm kev tsim kho tshiab hauv Tuam Tshoj txoj kev lag luam sensing sector, Lansensor's PDE series laser displacement sensors, featuring micron-level resolution, intelligent algorithms, and industrial-grade reliability, tau tshwm sim raws li cov kev xav tau kev daws teeb meem rau wafer manufacturing txheej txheem.
Precision Challenges hauv Wafer Manufacturing thiab qhov zoo ntawm Laser Displacement Sensors
Kev tsim khoom wafer suav nrog cov txheej txheem nyuaj xws li photolithography, etching, nyias-zaj duab xis tso, thiab kev sib txuas - txhua qhov yuav tsum tau nruj nruj ntawm micrometer lossis txawm tias qib nanometer. Piv txwv li:
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Hauv photolithography, kev sib raug zoo ntawm photomask thiab wafer yog qhov tseem ceeb los xyuas kom meej cov qauv hloov mus rau qhov chaw wafer.
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Thaum lub sij hawm thin-film deposition, kev tswj xyuas cov yeeb yaj kiab tuab yog qhov tseem ceeb los lav qhov kev ua tau zoo ntawm cov khoom siv hluav taws xob.
Txawm tias qhov sib txawv me ntsis tuaj yeem ua rau cov khoom tsis xws luag lossis tseem ua rau tag nrho cov wafers siv tsis tau.
Cov txheej txheem ntsuas kev ntsuas ib txwm muaj feem ntau poob qis hauv kev ua tau raws li qhov xav tau siab. Tsis tas li ntawd, lawv muaj kev pheej hmoo ua rau muaj kev puas tsuaj lossis kis kab mob ntawm qhov chaw wafer tsis yooj yim, thaum lawv cov lus teb qeeb qeeb ua rau lawv tsis txaus rau cov kev cai metrology txiav.
LanbaosensorPDE Series Laser Displacement Sensors: Qhov Zoo Tshaj Plaws rau Kev Siv Wafer
◆Tsis tiv tauj Laser ntsuas
Siv laser beam projection mus rau lub hom phiaj ntawm qhov chaw, tshuaj xyuas qhov cuam tshuam / cuam tshuam cov cim kom tau txais cov ntaub ntawv hloov chaw - tshem tawm kev sib cuag lub cev nrog wafers los tiv thaiv kev puas tsuaj thiab kev phom sij.
◆Micron qib Precision
Advanced laser technology thiab teeb liab ua algorithms xa micrometer-scale ntsuas qhov tseeb thiab kev daws teeb meem, ua tau raws li qhov xav tau tshwj xeeb ntawm cov txheej txheem wafer fabrication.
◆Kev teb sai heev (<10ms)
Enables real-time saib xyuas ntawm dynamic ntau lawm variations, tso cai tam sim ntawd deviation nrhiav kom tau thiab kho kom zoo manufacturing efficiency.
◆Exceptional Material Compatibility
Muaj peev xwm ntsuas cov khoom sib txawv thiab hom nto nrog lub zog ib puag ncig adaptability, haum rau ntau theem txheej txheem semiconductor.
◆Compact Industrial Design
Daim ntawv cog lus ua kom yooj yim rau kev sib koom ua ke rau hauv cov cuab yeej siv hluav taws xob thiab kev tswj hwm, ua kom muaj kev soj ntsuam cov txheej txheem ntse thiab kaw-kho hloov kho.
Daim ntawv thov Scenario ntawmPDE Series Laser Displacement Sensorshauv Wafer Processing
Lub sensorPDE Series Laser Displacement Sensors: Cov ntawv thov tseem ceeb hauv Wafer Manufacturing
Nrog rau kev ua tau zoo tshwj xeeb, Lansensor PDE laser hloov chaw sensors ua lub luag haujlwm tseem ceeb thoob plaws ntau cov txheej txheem wafer fabrication:
◆Wafer Alignment & Positioning
Rau cov txheej txheem photolithography thiab kev sib koom ua ke uas xav tau qhov tseeb micron-theem, peb cov sensors ntsuas qhov tseeb ntawm wafer txoj haujlwm thiab qaij lub kaum sab xis kom ntseeg tau tias lub ntsej muag zoo meej-rau-wafer kev sib raug zoo thiab kev sib txuas ntawm caj npab - txhim kho cov qauv hloov pauv.
◆Wafer Thickness Metrology
Ua kom tsis muaj kev sib cuag nrog cov thickness ntsuas nrog kev saib xyuas lub sijhawm tiag tiag thaum cov txheej txheem tso nyiaj, kom ntseeg tau tias qhov zoo tshaj plaws ntawm cov yeeb yaj kiab zoo.
◆Wafer Flatness Inspection
Tshawb xyuas wafer warpage thiab deformation deformation nrog sub-micron kev daws teeb meem los tiv thaiv cov wafers los ntawm kev nce mus rau hauv qab.
◆Nyias-zaj duab xis Thickness saib xyuas
Muab lub sij hawm real-time deposition thickness taug qab thaum lub sij hawm CVD / PVD cov txheej txheem los tswj cov hluav taws xob kev ua tau zoo specifications.
◆Surface Defect Detection
Txheeb xyuas qhov micron-scale deg anomalies (scratches, particles) los ntawm high-resolution displacement mapping, ho txhim kho qhov tsis xws luag.
◆Cov cuab yeej ntsuas ntsuas
Taug qab qhov tseem ceeb ntawm cov khoom hloov pauv (robot caj npab, theem txav) thiab tshuab vibrations rau kev kwv yees txij nkawm thiab kev ua kom zoo dua qub.
Lanbao sensor's PDE series tsis tsuas yog txuas cov thev naus laus zis tseem ceeb hauv Tuam Tshoj txoj kev lag luam high-end sensor tab sis tsim cov qauv tshiab thoob ntiaj teb nrog nws qhov kev ua tau zoo tshwj xeeb. Txawm hais tias kev txhawb nqa cov txiaj ntsig, txo cov nqi tsim khoom, lossis ua kom cov txheej txheem txuas ntxiv mus ntxiv, PDE series sawv ua koj qhov riam phom kawg rau kev kov yeej cov kev sib tw ntawm semiconductor kev tsim khoom!
Post lub sij hawm: May-08-2025